Copper Molybdenum Parts
Molybdenum Copper alloy combines Molybdenum and Copper to create a composite material with performance characteristics similar to Tungsten Copper alloy. However, its density is lower than that of Tungsten Copper alloy, making it particularly well-suited for applications in the aerospace and navigation industries.
Over the years, T&D has consistently delivered cutting-edge hermetic connector and packaging technologies to customers. This includes a controllable expansion composite matrix that ensures superior material stability and uniform thermal expansion characteristics. This provides designers with a practical solution to meet critical thermal parameters.
Advantages of Molybdenum Copper (MoCu):
- Design options for thermal expansion
- Excellent thermal conductivity
- Precision flatness capabilities
- Gold plating suitable for bonding
- Thickness ranging from .004″ to .500″
- Sharp corner radius
- Integrated ribs for added strength
- Precision complex geometry
- Minimal thermal expansion
- Favorable electrical conductivity
- Superior wear resistance
- Lighter compared to W-Cu
Typical Physical and Mechanical Properties:
| Material Composition | Density (g/cm3) | Thermal Conductivity W/moK 25°C | Coefficient of Thermal Expansion 10-6/°C |
| 85Mo/15Cu | 10.01 | 195 | 7.0 |
| 80Mo/20Cu | 9.96 | 204 | 7.6 |
| 70Mo/30Cu | 9.75 | 208 | 8.0 |
| 60Mo/40Cu | 9.62 | 223 | 9.3 |
| 50Mo/50Cu | 9.51 | 230 | 10.3 |
Common Application Areas:
- Heat Sinks and Spreaders
- Microwave Carriers
- Microelectronic Package Bases and Housings
- Ceramic Substrate Carriers
- GaAs and Silicon Device Mounts
- Laser Diode Mounts
- Surface Mount Package Conductors
- Microprocessor Lids
- Rocket Parts
- Optical Packages
- Power Packages
- Butterfly Packages
